IPC 9701 PDF

April 22, 2019

IPC Performance Test Methods and Qualification Requirements for Surface Mount Solder Attachments. IPC CD: PERFORMANCE TEST METHODS AND QUALIFICATION REQUIREMENTS FOR SURFACE MOUNT SOLDER ATTACHMENTS. Reliability of FPGA Assemblies. Pb/Sn & Pb-free Solders. Tested per IPC A by. Reza Ghaffarian, Ph.D. NASA-Jet Propulsion Laboratory, Caltech.

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Solder Joint Reliability | NTS

Please allow 2 business days for us to review and process your order. Representative temperature profile for thermal cycle test conditions. To view this site, you must enable JavaScript lpc upgrade to a JavaScript-capable browser.

This provides you with useful technical information for future designs, saving you time and money. Provides specific test methods to evaluate the performance and reliability of surface mount solder attachments of electronic assemblies.


See More Kpc Less. The electrical resistance is continuously monitored during testing using data loggers. Revision A includes Appendix B which provides recommended changes to the thermal cycling profiles given in the document when utilizing Pb-free solder joints.

Solder Joint Reliability

Javascript is disabled on your browser. Per IPC, temperature extremes are based on the product category with the low temperature usually 25C below kpc glass transition temperature Tg of the printed circuit board material.

When used with IPC-SM, it provides an understanding of the physics of SMT solder joint failure and an approximate means of relating performance tests 9071 to the reliability of solder attachments in their use environments. Thermal Cycling is usually performed at a transition rate of less than or equal to 20C per minute usually 10 to 14C per minute to avoid thermal shock with cycles per hour.

Product Description Product Details Back. Training Media Permissible Uses. Establishes levels of performance and reliability of the solder attachments of surface mount devices to rigid, flexible and rigid-flex circuit structures.


We will 97011 to accept orders via e-mail and web during our office closure. Thermal Cycling is the most common method of testing Solder Joint Reliability. Common test specifications include:. The results from different test programs can be compared to provide an understanding of design requirements for adequate reliability. Common 7901 specifications include: Whether you are trying to implement a new solder type or new component types, solder joint reliability testing is essential in providing confidence that your product will perform within its intended operating limits.